Dr Xin Fu Tan

Postdoctoral Research Fellow

School of Mechanical and Mining Engineering
Faculty of Engineering, Architecture and Information Technology

Overview

Dr. Xin Fu Tan's research interests encompass the areas of electronics packaging, hydrogen storage materials, lithium-ion batteries, synchrotron radiation techniques, and electron microscopy. Dr. Tan is currently employed as a Postdoctoral Research Fellow at The University of Queensland, working on an ARC Discovery Project titled "Intermetallic compounds for high-reliability electronic interconnections" (2020-2024). Additionally, Dr. Tan holds the position of a Japan Society for the Promotion of Science (JSPS) International Research Fellow at Kyushu University, contributing to the project "Improving Metal Hydrides to Diversify Energy Storage and Transportation" (2022-2024), as nominated by the Australian Academy of Science (AAS).

Dr. Tan completed their PhD thesis at The University of Queensland, focusing on the development of novel anode materials for lithium-ion batteries, from 2017 to 2020. Between 2010 and 2016, Dr. Tan worked as a Material Scientist at Hydrexia Pty. Ltd., a start-up company specialising in commercialising solid-state hydrogen storage systems based on lab-developed technology from The University of Queensland. They earned a Bachelor's degree (1st class honours) in Mechanical and Manufacturing Engineering at The University of Melbourne and a Master's degree in Advanced Engineering Materials at Chalmers University of Technology in Sweden. These experiences have endowed Dr. Tan with unique research expertise across various Materials Engineering fields, encompassing both academic and industrial settings.

Qualifications

  • Doctor of Philosophy, The University of Queensland
  • Diploma of Project Management
  • Masters (Coursework) of Manufacturing and Materials Engineering, Chalmers University of Technology
  • Bachelor (Honours) of Engineering, University of Melbourne

Publications

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Grants

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Supervision

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Publications

Journal Article

Conference Publication

  • Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722

  • Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743

  • Ye, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707

  • Hao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406

  • Abdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008

  • Tan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007

  • Tan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20

Other Outputs

Grants (Administered at UQ)

PhD and MPhil Supervision

Current Supervision